Press Release

December 21, 2001

IAR MakeApp™ for the Bluetooth™ protocol stack now supports the Taiyo Yuden Bluetooth modules
IAR Systems and Taiyo Yuden today announced that IAR MakeApp for the Bluetooth protocol stack now supports the Bluetooth modules from Taiyo Yuden. IAR Systems has adapted and optimized its Bluetooth software for the Taiyo Yuden modules for use in Bluetooth products worldwide.

IAR Systems has adapted and optimized its Embedded Bluetooth protocol stack technology to work well with the Bluetooth modules from Taiyo Yuden, which are targeted for products with built-in Bluetooth wireless technology.

The Embedded Bluetooth protocol stack from IAR Systems is one of the most compact in the world, which reduces manufacturing cost in serial production, due to reduced consumption of CPU and ROM memory resources.

“The stack support for the Taiyo Yuden modules strengthens IAR System’s position as the leading supplier of development tools for Bluetooth products” says Lars-Erik Stenkil, General Manager at IAR Systems in Jönköping , Sweden . “At the same time, Taiyo Yuden customers get a highly compact Bluetooth protocol stack which in turn reduces production cost for the complete Bluetooth product”.

“IAR System’s stack support for the Taiyo Yuden modules will promote the worldwide expansion of our Bluetooth module business” says Shoichi Sekiguchi, WIN-Group Development Division Leader of Taiyo Yuden Co., ltd.

About IAR Systems
By focusing on the embedded systems industry, IAR Systems has reached the position of leading supplier of software development tools for embedded microcontrollers. Since the company was founded in 1983, IAR has worked in close cooperation with the world’s major chip manufacturers to develop a wide range of programming tools supporting a large number of chip architectures. The tools today consist of highly efficient C and EC++ compilers in the IAR Embedded Workbench™ development environment, the device driver wizard IAR MakeApp™ for graphical configuration and initialization of the chip and creation of complete device drivers, and the IAR visualSTATE® graphic programming tool with a patented technology to generate validated and small production-ready code. IAR Systems also provides a total solution for Bluetooth™ protocol stacks and applications, from development of Bluetooth devices to qualification. IAR Design Services injects engineering expertise and experience into embedded system projects. It contributes to IAR’s mission to reduce the development time for embedded systems and accelerate time to market. IAR Systems has offices in the US , UK , Japan , Canada , Germany , Denmark , and Sweden . More information is available at www.iar.com.

About Taiyo Yuden
The global manufacturing operations of Taiyo Yuden Co., Ltd. embrace surface mount and leaded passive components, functional modules, CD-Rs, and DVD-Rs. The company is particularly strong in the high frequency multilayer chip inductors used in the cellular phones, with over 50% of the world market. The company also is a rapidly emerging leader in the Bluetooth module development and implementation; combines its expertise in multilayer component manufacturing, a high frequency circuitry design, advanced assembly technologies, and evaluation technologies; with aggressive Bluetooth research, development, and strategic partnerships. Taiyo Yuden becomes the first accredited BQTF in the Asia-Pacific Regions, including Japan , and the world’s first company offering a total Bluetooth solution―from modules development through logo certification test support. Taiyo Yuden has more than 17,000 employees worldwide and annual sales of over US$1.7 billion. The company’s North American subsidiary, Taiyo Yuden (U.S.A.), Inc., operates sales and engineering offices in Chicago , San Jose , San Diego , Dallas , and Raleigh . For more information, visit Taiyo Yuden’s web site at http://www.ty-top.com/.